Molded Carbon Plate "SKC-17"
Use semiconductor silicon wafers for small paths! You can use them just like graphite materials.
"SKC-17" is a compression-molded plate made from carbon powder and thermosetting resin, designed to match the strength characteristics of Chinese-made graphite materials. It has a density of 1.63, a bending strength of 14 MPa, and a bending modulus of elasticity of 3.65 GPa, and is used for small-diameter semiconductor silicon wafers. This plate is intended for customers who manually remove wafers from the plate after processing. 【Key Characteristics】 ■ Main Component: Synthetic graphite powder as the main component + unsaturated polyester resin ■ Manufacturing Method: Compression molding ■ Bending Strength: 14 MPa ■ Bending Modulus of Elasticity: 3.65 GPa *For more details, please download the PDF or feel free to contact us.
- Company：三昌化工
- Price：Other
